While every smartphone enthusiast is looking forward to the upcoming MWC 2018 event, here comes a benchmark listing of a Sony Xperia flagship which might take the spotlight away from every handset which is to be launched in Barcelona, next month.

Sony Xperia H8266, which was first seen on benchmark site GeekBench back in December, is once again in the news as it has appeared on AnTuTu benchmark with flagship specifications and new display design, going with the current trend of 18:9 aspect ratio-panels.

For the unknown, Sony Xperia H8266 is said to the XZ1 successor which is expected to be called Sony Xperia XZ2, when launched. Moreover, this could be the first smartphone from the company to come with an 18:9 aspect ratio display while getting its power through the recently launched Snapdragon 845 SoC.

Yes, you read it right. Sony is going to play a trump card with the Sony Xperia H8266 which scored 2393 and 8300 points in the single-core and multi-core test, respectively, on GeekBench in December.

Sony Xperia H8266 specificationsAlthough there has been no word on the availability or launch of Sony Xperia H8266, the smartphone recently surfaced on another benchmark site AnTuTu revealing a lot of details about the handset, and if this is what Sony is planning to launch as its flagship for the year, we might have a clear winner here.

According to the listing, apart from the SD 845 SoC, Sony Xperia H8266 features a 2160 x 3840-pixel edge-to-edge display, 4GB RAM and 64GB of internal memory. While more power, there is an Adreno 630 GPU coupled with the chipset, the handset will run of Stock Android Oreo out of the box.

Alleged Sony Xperia H8266 specs by AnTuTuWhile the listing didn’t reveal any details about the camera setup, according to a separate rumor, there will be dual 12MP rear cameras while selfie duties will be handled by a 15MP sensor. The device is backed by a 3,240mAh non-removable battery coupled with support for Qnovo Adaptive Charging while the whole body is secured by IP68-certification, meaning that the Sony Xperia H8266 is dust and water resistant.

All the past leaks related to the Sony H8266 hints that it could be the much anticipated Xperia XZ2 flagship, although the Japanese OEM hasn’t made an official statement yet. Moreover, if it gets introduced at the Mobile World Congress 2018 its availability won’t be possible before mid-2018 due to industry-wide shortage of Qualcomm’s Snapdragon 845 chipset, which Samsung has stocked for its upcoming Galaxy S9-Duo.

Sony Xperia H8266 Expected Specifications (Round-Up)

  • Full HD+ (2160 x 3840) TRILUMINOS Display with X-Reality technology
  • Octa-Core Snapdragon 845 SoC coupled with Adreno 630 GPU
  • 4GB RAM and 64GB of internal storage, expandable up to 256GB via microSD card
  • Android 8.0 (Oreo) out of the box
  • Dual 12MP rear cameras with dual-tone LED flash and a 15MP front camera.
  • Water And Dust Resistant (IP65/IP68)
  • Dimensions: 157 × 78× 8.1 mm and Weight: 159g
  • 3210/3240mAh battery with support for Qnovo Adaptive Charging

Reports also suggest that the Japanese electronics manufacturer is working on an advanced model of Sony Xperia XZ2, called the Xperia XZ2 Pro which is rumored to debut as the world’s first smartphone featuring 4K OLED display, 18:9 aspect ratio and resolution of 3840×1920 pixels. Other expected features of Sony Xperia XZ2 Pro include Snapdragon 845 chipset, 6GB RAM, 128GB of internal storage, Android 8.1 Oreo out of the box and dual rear cameras.

Facebook Comments